Cost-effective, energy-efficient optical links for datacom and consumer applications based on advanced CMOS optoelectronic IC
讲座名称：
Cost-effective, energy-efficient optical links for datacom and consumer applications based on advanced CMOS optoelectronic IC
讲座时间：
2014-03-27
讲座人：
C. Patrick Yue
形式：
校区：
兴庆校区
实践学分：
讲座内容：
Investigator
讲座时间：2014年3月27日 上午9:00-9:50
讲座地点：电信学院第一会议室（西一楼三楼）
主办方：西安交大-香港科大可持续发展学院 & 西安交大电子与信息工程学院
Background
Optical communication technologies have traditionally been applied to long-haul (100 m and above) telecommunication applications because of the more stringent performance requirements including channel bandwidth and loss per distance. The higher cost of the optical-to-electrical (OE) and electrical-to-optical (EO) modules can therefore be justified. During the last few years, the proliferation of mobile multimedia devices and cloud computing infrastructure has created an unprecedented demand and exponential growth in bandwidth requirement even for short range (1 to 50 m) applications, such as peripheral and internal connectivity for consumer electronics and cabling between servers in data centers. These applications are traditionally addressed by copper-based electrical links. While the cost of optical fiber is lower than copper wires such as CAT-5 cables, the state-of-the-art OE-EO modules are still too costly and power hungry due to the many discrete components involved including laser source, photo-detector and transceiver circuit blocks. Another emerging application of optical links is replacement of electrical cables and micro-connectors inside the chassis of portable smart handheld devices with high-resolution display. The advantage of employing optical link includes reduced wiring congestion, lessened electromagnetic interference (EMI) and increased routing flexibility for bends and turns.
In 2011, the first low-cost short-range (~1 m) optical link based on the new technology LightPeak (a new standard initiated by Intel) became commercially available. It was deployed in the form of an active optical cable (AOC) for connecting a laptop and its docking station (Sony Viao Z-Series). The 4x10-Gbps OE-EO module is a chip-on-board design and is embedded inside a USB-compatible connector. The light wavelength used is 850 nm. This marks an important milestone in the application of optical I/Os beyond telecommunication for consumer electronics. The key enabling technology behind this advancement is a highly integrated CMOS optoelectronic (OE) transceiver IC operating at 10 Gbps and a cost-effective optical module packaging manufacturing process. For the next generation of Light Peak modules, to further reduce the manufacturing cost to better penetrate the consumer electronics market, the OE transceiver circuit is projected to feature adaptive equalization for compensating the variation in the packaging parasitic associated with the OE-EO interfaces and the tolerance of the off-chip VCSEL and photo-detector (PD) characteristics.
In addition to cost consideration, energy-efficiency is of paramount importance especially for battery-powered consumer electronics such as laptop and tablets. Power consumption is also critical for datacom applications, for example, to reduce data center electricity consumption for powering and cooling the continuously running data traffic. The ever-improving copper-based electrical link solutions can now deliver an efficiency of 10 mW/Gbps/m (or 10 pJ/bit/m) for up to 1-meter distance. For short-distance optical link to be competitive, low-power optoelectric transceiver design is needed to avoid being the bottleneck of the overall link power consumption, and hence to maintain the superior efficiency of optical links. The state-of-the-art LightPeak AOC can deliver about 8 to 15 mW/Gbps/m.
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