Advances of EMC in Electronics Systems
讲座名称：
Advances of EMC in Electronics Systems
讲座时间：
2013-06-09
讲座人：
李尔平
形式：
校区：
兴庆校区
实践学分：
讲座内容：
应西安交通大学电力设备电气绝缘国家重点实验室副主任耿英三教授和实验室李兴文教授邀请，新加坡国家高性能计算科学研究院电磁与电子研究室主任和首席科学家李尔平教授访问我校并作学术报告。
时 间：2013年6月9日（周日）上午9:30～11:30
地 点：东一楼电器教研室二楼会议室
报 告：Advances of EMC in Electronics Systems
Abstract: Rapid growth and convergence of digital computing and wireless communication have been driving the semiconductor technology in today’s nanometer regime to continue its evolution following the scaling law, i.e., Moore’s law at the semiconductor transistor device and on-chip level, and “More than Moore” at the intra-chip interconnect and packaging level. The through-silicon via (TSV) technology, which is explored by many researchers for three-dimensional (3D) integration, represents such a latest example of scaling. It has the potential benefits of improving the electrical performance including speed, bandwidth and functionality, and reducing power consumption by shortening the interconnection path in the 3D ICs. However, the development of nano-scaled integrated circuits and 3D integration faces several challenges in terms of electrical performance, such as the electromagnetic compatibility (EMC) between circuits, signal integrity (SI) and power integrity (PI) in electronic integration are of vital importance. In addition, the material property on electromagnetic performance, aging effects, thermal-electrical coupling. This presentation will cover the advances and challenges of EMC modeling, measurement, design in semiconductor integrated circuits and the system package integration.
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