Long-term reliability of Pb-free solder between copper interconnect and silicon in photovoltaic solar cell
讲座名称：
Long-term reliability of Pb-free solder between copper interconnect and silicon in photovoltaic solar cell
讲座时间：
2017-04-26
讲座人：
Omid Mokhtari
形式：
校区：
兴庆校区
实践学分：
讲座内容：
讲座题目：Long-term reliability of Pb-free solder between copper interconnect and silicon in photovoltaic solar cell
讲座时间：2017年4月26日(周三)下午14:30-16:30
讲座地点：北二楼11楼会议室
讲座人：Omid Mokhtari
讲座内容：受能动学院邀请，日本大阪大学连接焊接研究中心Omid Mokhtari特聘研究员将于2017年4月25日到4月27日访问我校，并为师生做以下学术报告：
报告摘要：Photovoltaic (PV) solar cell has become the most representatively renewable resource due to the worldwide green energy development. Although the reliability status of PV systems is reported as acceptable and non-critical, the identification, adoption, and utilization of reliable interconnection technology to assemble crystalline silicon solar sell in PV module are critical to ensure that the device performs continually up to 20 years of its life span. It has been widely reported that the daily thermal cycles which PV modules are subjected to in the field is one of the causes of degradation experienced by its interconnection.
After removal of Pb from most of interconnection technology, the PV industry is also coping with the transition to Pb-free solder, from the traditionally used eutectic Sn36Pb2Ag solder, for interconnection technology. This talk will explain the background research on various types of solder joints in microelectronics manufacturing which can be used as leverage to support future research on the long-term reliability of solar cells in PV industry. In previous studies, the microstructure, mechanical properties, and fracture mechanism of various solder joints have been investigated which will be presented in this talk.
This will be followed by exhibiting the current developments and also the challenges in the interconnection technology used in PV solar cells. The common failure mechanism in crystalline silicon PV module will be shown and the reliability issues in thermo-mechanical behavior of solder joints will be explained.
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